Jack F. McDonald

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Publication Statistics

Publication period start
1987
Publication period end
1987
Number of co-authors
4

Co-authors
Number of publications with favourite co-authors

Productive Colleagues
Most productive colleagues in number of publications

Publications

McDonald, Jack F., Greub, Hans J., Steinvorth, Randy H., Donlan, Brian J., Bergendahl, Albert S. (1987): Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. In IEEE Computer, 20 (4) pp. 21-35.